DZY系列划片刀

DZY型采用独特工艺，将划片刀与铝合金法兰合成一体，使其具有更高的精度。能对各种硬脆材料进行开槽和切断。
如:硅晶圆、砷化镓等金属化合物半导体。
采用精选的金刚石磨料，使划片刀具有卓越的切削性能和超长的使用寿命。
采用先进的制造工艺对金刚石磨料的浓度和结合剂的控制，有效降低了切割时材料崩边发生的概率。装卸作业更方便。

DZY type adopts a unique process to integrate the dicing blade and aluminum alloy flange, so that it has higher accuracy. It can slot and cut various hard and brittle materials.
Such as: silicon wafer, gallium arsenide and other metal compound semiconductors.
The selected diamond abrasive is used to make the scoring tool have excellentdicing performance and long service life.
Advanced manufacturing technology is adopted to control the concentration of diamond abrasive and the bond, which effectively reduces the probability of material edge collapse during dicing. The loading and unloading operation is more convenient.